GENESIS Silicon 900 8g

Thermal paste · 12.8 W/m·K · 8 g

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Type Thermal paste
conductivity 12.8 W/m·K
weight 8 g

GENESIS Silicon 900 8g is thermal paste rated 12.8 W/m·K. A pea-sized drop in the middle of the processor is enough; the cooler spreads it. It came out in 2025.

Released: 2025-03-29

Specifications

Key specs

Type: Thermal paste
conductivity: 12.8 W/m·K
weight: 8 g
Released: 2025-03-29
Part number: NTG-2330
EAN / UPC: 5901969449471

Features

Type: Thermal paste
Thermal conductivity: 12.8 W/m·K
Density: 2.8 g/cm³
Operating temperature (T-T): -50 - 250 °C

Weight & dimensions

Weight: 8 g

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About this product

Optimal density and good thermal conductivity properties are not enough. In the kit you will find a moistened cloth and spatula for easy application. Meet GENESIS Silicon 900 - a high-performance thermal conductive paste that will help you win the unequal battle against temperatures. Optimal density and good thermal conductivity properties are not enough. In the kit you will find a moistened cloth and spatula for easy application.

EFFECTIVE FIGHT AGAINST TEMPERATURES

Low component temperatures? From today you can achieve them with GENESIS Silicon 900 - an easy-to-apply thermal conductive paste distinguished by high thermal conductivity (12.8 w/-K). You do not need to heat it up, you will gain optimal thermal conductivity values from the first seconds after application. What's more, GENESIS paste is distinguished by its safe formula, which means no conductivity and resistance to corrosion.

SIMPLE APPLICATION

Applying GENESIS Silicon 900 is easy not only because of its optimal formula (2.8 g/cm3). This is also due to the included spatula and a moistened cloth, which will allow you to get rid of residual dirt.