Gigabyte ME03-CE0 Rev. 1.x

SoC · SP6 · ATX · DDR5

See today's price, delivery and offers at the store.

Chipset SoC
Form factor ATX
Memory slots 12
Socket SP6
Memory type DDR5

Gigabyte ME03-CE0 Rev. 1.x is an ATX and SoC chipset motherboard for SP6 processors and DDR5 memory. It came out in 2026.

Released: 2026-06-02
Socket: SP6

Specifications

Key specs

Chipset: SoC
Form factor: ATX
Memory slots: 12
Socket: SP6
Memory type: DDR5
Released: 2026-06-02
Part number: 9ME03CE0MR-000
EAN / UPC: 4719331858551

Processor

Processor manufacturer: AMD
Processor socket: Socket SP6
Compatible processor series: AMD EPYC 8005 Series, AMD EPYC 8004
Maximum number of SMP processors: 1
Supported processor sockets: SP6

Memory

Supported memory types: DDR5-SDRAM
Number of memory slots: 12
Memory slots type: DIMM
Memory channels: Hexa-channel
Supported memory clock speed (max): 6400 MHz

View all specifications +9 more sectionsShow fewer specifications

Storage controllers

Supported storage drive types: HDD & SSD
Supported storage drive interfaces: M.2, PCI Express 3.0, MCIO 4i
Number of HDDs supported: 12
Number of storage drives supported: 13

Graphics

Parallel processing technology support: Not supported
On-board graphics card model: Aspeed AST2600

Internal I/O

USB 3.2 Gen 1 (3.1 Gen 1) connectors: 1
Front panel connector: Yes
ATX Power connector (24-pin): Yes
CPU fan connector: Yes
Number of CPU fan connectors: 1
Number of chassis fan connectors: 5
EPS power connector (8-pin): Yes
Number of EPS power connectors (8-pin): 2
TPM connector: Yes

Rear panel I/O ports

USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity: 2
Ethernet LAN (RJ-45) ports: 2
VGA (D-Sub) ports quantity: 1
Serial ports quantity: 1

Network

Ethernet LAN: Yes
Ethernet interface type: 10 Gigabit Ethernet
LAN controller: Broadcom BCM57416

Features

Motherboard chipset: AMD SoC
Product colour: Blue
Component for: Server
Motherboard form factor: ATX
Motherboard chipset family: AMD
Cooling type: Passive
Power source type: ATX

Expansion slots

PCI Express x16 (Gen 4.x) slots: 3
PCI Express x16 (Gen 5.x) slots: 3
Number of M.2 (M) slots: 1
1st M.2 largest key size: 22110
1st M.2 highest PCI Express generation: 3.0

Operational conditions

Storage temperature (T-T): -40 - 60 °C
Operating temperature (T-T): 10 - 40 °C
Operating relative humidity (H-H): 8 - 80%
Storage relative humidity (H-H): 20 - 95%

Weight & dimensions

Width: 304.8 mm
Depth: 243.8 mm

Check the manufacturer's page before buying.

Ready to buy? Get the Gigabyte ME03-CE0 Rev. 1.x at today's price.Buy now

Compatible processors

SP6 socket

None in the catalog yet.

Compatible memory

DDR5

Kingston FURY Beast 32GB (2x16) DDR5-6000 CL3632 GB (2x16) · DDR5
ADATA XPG Lancer RGB 32GB (2x16) DDR5-6000 CL3032 GB (2x16) · DDR5
Klevv Cras V RGB32 GB (2x16) · DDR5
Klevv 32GB (2X16GB) 6400MHz CL32 DDR5 GAMING RAM MODULE 32-38-38-78 1.35V URBANE V RGB BLACK KIT32 GB (2x16) · DDR5
Klevv Bolt V32 GB (2x16) · DDR5
Klevv Fit V16 GB (1x16) · DDR5
Kingston 64GB 5200MT/s DDR5 CL36 DIMM (Kit of 2) FURY Beast Black EXPO64 GB (2x32) · DDR5
VeloxStor 7011-DDR, 16 GB, DDR5, 4800 MT/s, 288-pin UDIMM16 GB (1x16) · DDR5

About this product

Big Performance | Low Power | Small Footprint Optimized for edge, telco, and cloud storage environments, the AMD's SP6 (LGA 4844) socket, powering AMD EPYC 8005 and 8004 Server processors, delivers a balance of energy efficiency and cost performance. Built to maximize performance/watt and performance/$, the 8005/8004 CPUs retain core EPYC capabilities, including multithreading, hardware root of trust, and DDR5 memory with ECC support. The latest EPYC 8005 processors further raise the bar with up to 84 cores, 168 threads, and support for 6400 MT/s DDR5, enabling higher compute density in space- and power-constrained deployments. Purpose-built for modern distributed infrastructure, AMD's SP6 platform excels in remote deployments, software-defined storage (SDS), and decentralized fault tolerance, where workloads must run efficiently at the edge, scale seamlessly across distributed data planes, and remain resilient in the face of node or network disruptions.

User manual (PDF)